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Modem & Applications : OMAP710
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Digital Baseband - Availability Disclaimer

The OMAP710 combines a dedicated TI-enhanced ARM925 application processor and a TI DSP-based GSM/GPRS baseband, making it ideal for smartphone or high-end handset products. It is intended for high-volume wireless OEMs and ODMs and is not available through distributors.

The OMAP710 processor is an integral part of the TCS2500 GPRS chipset solution.

OMAP710 Features:

Low-Power, High-Performance CMOS Technology

  • Low-voltage 150 nm technology Semiconductor Insights Insight Award Winner
  • 1.8V cores, 3.3V I/Os

TI925T ARM9TDMI Core

  • Up to 132 MHz (maximum frequency)
    Voltage: 1.9v nominal
  • 16KB I-cache; 8KB D-cache
  • 192-KB of shared internal SRAM - frame buffer
  • Support for 32-bit and 16-bit (Thumb mode) instruction sets
  • Data and program MMUs
  • Two 64-entry translation look-aside buffers (TLBs) for MMUs
  • 17-word write buffer

GSM/GPRS Digital Baseband System

  • GSM ultra-low power device (ULPD)
  • HW accelerator for GPRS encryption
  • SIM i/F (3.3V/1.8V compliant)
  • 256 KB internal SRAM
  • GSM real time clock
  • GSM 900, PCS1900, and DCS 1800 cellular telephones, DBB ROM-based
  • Class 8 GPRS, DBB ROM-based

Application Subsystem

  • Supports Linux®, Microsoft® Windows® CE, Palm OS™ and Symbian OS™, Microsoft Smartphone 2002, Microsoft Pocket PC 2002 and Nokia Series 60
  • Power management with system clock DPLL
  • 65-MHz memory interface
  • 64-MB SDRAM interface
  • 128-MB burst flash, SRAM and ROM I/F
  • 192-KB internal SRAM with frame buffer DMA channel
  • LCD controller: 2-16 bpp
  • Two 32-bit timers and watchdog timer
  • USB client with 48 MHz DPLL
  • Enhanced audio controller
  • Supports I2S and AC97 codec
  • Optimized DMA
  • CompactFlash interface
  • Three UARTs, one support IrDA
  • Bluetooth™ interface
  • SPI controller
  • Programmable three-color LED pulse generation
  • Individual power saving modes for MPU and GSM subsystems
  • IEEE 1149.1 JTAG boundary scan logic
  • GPIO capability for unused function pins
  • I²C master and slave interface
  • Micro-wire controller

Unique Die-ID cell

289-ball, 12 mm x 12 mm MicroStar BGA™ Package




Availability Disclaimer

This product is intended for high-volume wireless OEMs and ODMs and is not available through distributors. If your company meets this description, please contact your TI sales office.
 
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