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Basic Multimedia : OMAP310
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OMAP310 - Availability Disclaimer

The OMAP310 processor is a power-efficient, TI-enhanced ARM925 application processor that targets cost-sensitive 2.5G and 3G handsets and PDAs. It is intended for high-volume wireless handset manufacturers and is not available through distributors.

OMAP310 Features:

Low-Power, High-Performance CMOS Technology

  • Low-voltage 130 nm technology

TI925T ARM9TDMI Core

  • Up to 144 MHz (maximum frequency)
    Voltage: 1.5v nominal
  • 16KB I-cache; 8KB D-cache
  • Support for 32-bit and 16-bit (Thumb mode) instruction sets
  • Data and program MMUs
  • Two 64-entry translation look-aside buffers (TLBs) for MMUs
  • 17-word write buffer

192-KB of shared internal SRAM - frame buffer

Memory Traffic Controller (TC)

  • 16-bit EMIFS external memory interface
  • 16-bit EMIFF external memory interface

9-Channel System DMA Controller

Digital Phase-Locked Loop (DPLL) for MPU/DSP/TC Clocking Control

IEEE Standard 1149.1 (JTAG) Boundary Scan Logic

Application Subsystem

  • Supports all major operating systems
  • Three 32-bit timers and watchdog timer
  • 32-kHz timer
  • Level1/Level2 interrupt handlers
  • USB1.1 host interface with up to 3 ports
  • USB1.1 function interface
  • One integrated USB transceiver for either host or function
  • Multichannel buffered serial port (McBSP)
  • I²C master and slave interface
  • Micro-wure serial interface
  • MMC/SD interface
  • HDQ/1-wire interface
  • Camera interface for CMOS sensors
  • ETM9 trace module for TI925T debug
  • Keyboard matrix interface (6 x 5 or 8 x 8)
  • Up to 10 MPU general-purpose I/Os
  • Pulse-width tone (PWT) interface
  • Pulse-width light (PWL) interface
  • Two LED pulse generators
  • Real-time clock
  • LCD controller with dedicated system DMA channel
  • Two multichannel buffered serial ports
  • Two multichannel serial interfaces
  • Three UARTs (one supporting SIR mode for IrDA)
  • Four interprocessor mailboxes
  • Up to 14 shared general-purpose I/Os

289-ball, 12 mm x 12 mm MicroStar BGA™ Package




Availability Disclaimer

This product is intended for high-volume wireless OEMs and ODMs and is not available through distributors. If your company meets this description, please contact your TI sales office.
 
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